Saki Corporation Exhibits 2D and 3D Automated Inspection Systems at IPC APEX Expo Booth #801

SAN JOSE, Calif. — (BUSINESS WIRE) — February 18, 2015Saki Corporation, an innovator in the field of automated optical inspection equipment, announces that its new BF-X3 in-line 3D automated X-ray inspection, BF-3Di automated optical inspection, and BF-10BT offline 2D automated optical inspection systems will be exhibited at IPC APEX Expo 2015, February 24-26, 2015 in San Diego, California, Booth #801.

Saki’s BF-X3 in-line 3D automated X-ray inspection system measures solder joint structures, even non-wetting and head-in-pillow, creating 3D data for every solder joint. The BF-X3 uses planar computed tomography (PCT) to capture 100 slices through the board, solder joints, and components, analyzing their internal structures for a true volumetric representation of 3D imaging. Automated inspection technology perfectly separates the top and bottom of the PCB, corrects position misalignment and warpage, and measures and classifies defects, creating 3D data for the entire sample. It gives best-in-class Cpk and gage repeatability and reproducibility and maximum test coverage with lowest escape and false call rates. The BF-X3 inspects and measures the solder joint structures of BGAs, LGAs, QFNs, plated through-holes, leaded ICs, and PoP lamination in 3D with high definition.

Saki’s BF-3Di uses its unique optical design and 4-way projection for 3D inspection of all parts on the PCB with brightness controlled and shadows eliminated. It inspects heights up to 20mm and parts as small as 01005s, capturing reversed or inclined components with an escape of less than 1 ppm. Its high-speed, real-time measurement for a broad range of substrate coverage greatly reduces programming and debugging time. Inspection data is quickly and easily generated from CAD data.

For offline 2D automated optical inspection, especially for double-sided boards, Saki is showing its BF-10BT system. It inspects both sides of the board in one process, detecting solder balls down to 150μm, with 10μm resolution and superior data handling. Its robust and highly repeatable hardware is built for 24/7 continuous operation. The system is perfect for final inspection, through-hole inspection after wave or selective soldering, and manual inspection.

“Saki's 3D inspection systems are built on 20 years of proven 2D imaging technology and 10,000 fielded units,” said Satoshi (John) Otake, deputy general manager, Saki Corporation who heads up Saki America. “Saki has a complete line-up of 3D inspection solutions -- SPI, AOI, and X-ray, and also offers excellent SPC, production management, and connectivity tools. We invite all PCB manufacturers who want to ensure that their products are of the highest quality to stop by our booth at APEX and talk to our technical experts.”

For more information email Saki at saki.us@sakicorp.com, call +1 408-456-0332, follow us on twitter at www.twitter.com/SakiCorp_us, or visit our website at www.sakicorp.com.

See Saki at IPC APEX Expo 2015, Booth #801

High resolution photo available at http://adobe.ly/1zYeseS

About Saki Corporation

Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO9001:2008 certifications.



Contact:

SAKI America Inc.
Satoshi (John) Otake
Deputy General Manager
408-444-0287
Email Contact
or
AR Marketing, Inc. (agency)
Andrea Roberts, 858-204-9584
Email Contact




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