VANCOUVER, British Columbia, March 25, 2019 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX: ITC and OTCQX: ISYRF) (“Intrinsyc” or the “Company”), a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 660 µSOM (micro System on Module) and Development Kit.
Intrinsyc’s Open-Q™ 660 µSOM is an ultra-compact (50mm x 25mm) production-ready embedded computing module. The SOM is powered by the Qualcomm® SDA660 system on chip (SoC), a product of Qualcomm Technologies, Inc., and is designed to support high-performance, intelligent, on-device processes utilizing heterogenous compute capabilities to power a variety of high-performance consumer and industrial IoT devices.
The Qualcomm SDA660 features eight Qualcomm® Kryo™ 64-bit 260 cores that are divided in two clusters - a fast cluster of four cores with up to 2.2 GHz and a power saving efficiency cluster of four cores with up to 1.8 GHz. Additional high-end features in Qualcomm SDA660 mobile platform include the powerful Qualcomm® Artificial Intelligence (AI) Engine), Qualcomm Spectra™ ISP, and Qualcomm® Hexagon™ 680 DSP with Hexagon Vector eXtensions (HVX), designed to support Caffe2 and Tensorflow for machine learning and image processing.
“Intrinsyc’s Open-Q™ 660 µSOM is an ideal platform to power the growing demand for consumer and industrial IoT devices capable of artificial intelligence and machine learning,” said Cliff Morton, Vice President, Solutions Engineering, Intrinsyc. “To assist with integration of our System on Modules into customer products, Intrinsyc offers strong capabilities in all phases of product development. Services include everything from electrical and mechanical design to software development, including camera and audio tuning, artificial intelligence, power optimization, device management, security, and more.“
“We are proud to see Intrinsyc’s new micro-SOM product being powered by the Qualcomm SDA660,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies, Inc. “Qualcomm Technologies is driving the Internet of Things forward with our cutting-edge compute and connectivity technologies, and we are honored to enable a bright future of IoT devices along with Intrinsyc.”
Open-Q™ 660 µSOM Specifications:
- Qualcomm® SDA660 SoC:
° Qualcomm® Kryo™ 260 CPU (up to 2.2GHz)
° Qualcomm® Adreno™ 512 GPU
° Qualcomm® Hexagon™ 680 DSP with Hexagon Vector extensions
- System Memory: eMCP – 4GB LPDDR4x RAM + 32GB eMMC storage
- Wireless Connectivity: Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2x2 MU-MIMO + Bluetooth 5.x
- Display Interfaces:
° 2x MIPI 4-lane DSI + touch panel
° VESA DisplayPort v1.3 via USB Type-C, up to 4K30 or 2K60
- Camera Interfaces:
° 3x MIPI CSI D-PHY1.2 camera ports
° Dual 14-bit Qualcomm Spectra™ ISP supports up to 2 x 16MP cameras
- Video Performance:
° Encode: 4K30 HEVC/H.264/VP8/MPEG4
° Decode: 4K30 8-bit: H.264/VP8/VP9, 4K30 10-bit: HEVC
° Concurrent: 1080p60 Decode + 1080p30 Encode
- Audio Interfaces:
° SLIMBus to support Qualcomm® WCD9335 audio codec (off-SOM)
° Multi-channel I2S digital audio interface
- I/O Interfaces:
° 1x USB3.1 Gen1 Type C
° 1x USB 2.0 Host
° 1x SDIO 4-bit interface
° General purpose UART, I2C, SPI
° Sensor interface - SPI, UART, I2C to sensor DSP core
- Power: Integrated battery management on SOM
- Size: 50mm x 25mm
- Operating System: Android 9 Pie
Additional information is available at:
To help IoT device makers accelerate time to market, Intrinsyc provides the Open-Q™ 660 µSOM Development Kit, as well as turnkey product development services, driver and application software development, technical support, and documentation.
Intrinsyc’s Open-Q 660 µSOM Development Kit is a full-featured development platform including the software tools and accessories required to immediately begin development. The development kit marries the production-ready Open‐Q™ 660 µSOM with a carrier board providing numerous expansion and connectivity options to support the development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible. The Development Kit is available for purchase at https://shop.intrinsyc.com/products/open-q-660-usom-development-kit
Contact Intrinsyc at Email Contact with your product requirements and have one of the Company’s solution architects help plan for your successful product development and launch.
ABOUT INTRINSYC TECHNOLOGIES CORPORATION
Intrinsyc provides comprehensive product development services, as well as the industry’s highest-performance production-ready computing modules, to enable rapid commercialization of embedded and Internet of Things (“IoT”) products. Intrinsyc has successfully delivered over 1,300 client projects including sophisticated consumer and industrial IoT products like: robotics, connected cameras, smart displays, augmented reality, smart buildings, wearables, in-vehicle infotainment, and many others. Intrinsyc’s Open-Q™ System on Modules incorporate the industry’s most advanced Qualcomm® Snapdragon™ processor technology from Qualcomm Technologies, Inc., and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market. Intrinsyc is publicly traded (TSX: ITC and OTCQX: ISYRF) and is headquartered in Vancouver, BC, Canada; with additional product development centers in Taipei, Taiwan, and Bangalore, India.
For more information, please contact:
Vice President, Client Solutions
Intrinsyc Technologies Corporation
Email: Email Contact
Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.
Qualcomm, Snapdragon, Kryo, Adreno, Hexagon, and Qualcomm Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries
Qualcomm SDA660, Qualcomm WCD9335, Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Spectra, and Qualcomm Artificial Intelligence Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners.
© Intrinsyc Technologies Corporation all rights reserved