EMIF06-AUD01F2 saves up to 77% of board space compared to previous discrete solutions, with improved audio performance and ESD protection
The EMIF06-AUD01F2 eliminates audible handset demodulation noise, or 'bumble-bee' noise, by achieving -25dB attenuation (S21) throughout the stop- band 800-2480MHz using high-density 1.3nF PZT (lead, zirconate titanate) capacitors on the microphone lines. The device also achieves high ESD protection through the combination of integrated TVS (transient voltage suppressor) diodes, low-inductance packaging, and the Z-R-Z pi-filter topology.
As the first device to combine filtering and ESD protection for all handset speaker and microphone channels, the EMIF06-AUD01F2 saves more than 50% of board space compared to previous integrated solutions using two ICs with external resistors, and up to 77% compared to alternative discrete solutions. All necessary biasing circuitry is also integrated, as well as a 10-Ohm series resistor in the speaker output, thereby minimizing external components. The low package profile of 0.65mm also helps designers implement high functionality within cutting-edge, ultra-slim handset styles.
The space-saving advantages are combined with better audio performance and higher ESD protection compared to integrated or discrete alternatives. The integrated TVS diodes have a 20V peak clamping voltage, enabling the device to meet IEC61000-4-2 level 4 ESD protection at the external pins. Total harmonic distortion (THD) is less than -75dB, while the device achieves high audio- power transfer by delivering 135mA per speaker channel ensuring excellent sound reproduction. This is achieved thanks to the high thermal efficiency of the wafer-level flip-chip package, which supports 285mW total continuous power dissipation.
The EMIF06-AUD01F2 is already in volume production, and is available at $0.55 for 1000 pieces.
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